The cooling solution provided by API Heat Transfer features high integration and innovation, including the following aspects: Open-loop cooling isolation design, effectively preventing cross-contamination of cooling media; amorphous element cooling circuit with water, realizing efficient heat conduction; natural air or water cooling mode, ensuring flexible adaption to different cooling scenarios; CDU cooling element, enhancing the core cooling capability; adjacent air-cooled module cooling coils, improving the local cooling efficiency; introduction of chiller bypass mechanism, optimizing the system energy efficiency; air-cooled/liquid-cooled chiller coils and heat exchangers, meeting diverse cooling requirements. This solution also integrates the waste heat recovery function to further explore the potential of energy utilization. The advanced design ensures successful improvement of the cooling efficiency, significant reduction of the system energy consumption and strong adaptability to different water source conditions and complex environments, thereby providing reliable support for stable operation of the chip and effectively enhancing the overall energy utilization.
For more details, please visit API Heat
Transfer website or contact us