• Water-Side Economizer Cooling Transfers heat from the data center loop to cooling towers or dry coolers, enabling “free cooling” and reducing chiller runtime
• Primary-to-Secondary Loop Isolation Separates facility water from critical IT cooling loops to maintain cleanliness and protect sensitive equipment
• Direct-to-Chip Liquid Cooling Support Removes heat from CDU loops serving CPUs/GPUs operating at high heat flux
• Rear-Door Heat Exchanger Integration Supports rack-level cooling by rejecting heat from rear-door coil loops to facility water systems
• High-Temperature Warm Water Cooling Efficiently handles elevated return temperatures (80–120°F) for improved energy reuse and system efficiency
• Immersion Cooling Secondary Loop Cooling Cools the fluid loop connected to immersion tanks, maintaining stable temperatures in ultra-high-density deployments

Computational Fluid Dynamics (CFD)

Optimized through advanced Computational Fluid Dynamics (CFD), allowing engineers to visualize flow distribution, identify inefficiencies, and refine plate geometry for peak thermal performance. These simulations validate uniform velocity profiles, minimize fouling potential, and ensure consistent heat transfer across the entire plate pack. Ideal for high-demand applications including hyperscale and colocation data center cooling, process cooling in chemical and petrochemical facilities, district energy systems, and industrial HVAC. Its scalable, modular construction allows for easy capacity expansion, while maintaining a compact footprint and straightforward maintenance access.

Delivers reliable, energy-efficient performance backed by rigorous engineering and proven field results.

• n ASME 
• n PED 
• n AS1210 
• n NR-13 
• n CRN