The 12th edition of Asia Data Centre Expo will be held at Sands Expo and Convention Centre, Singapore, from September 29 to 30. As a seasoned thermal solution provider with 147 years of dedicated expertise in the industrial heat transfer sector, API Heat Transfer will present its full range of technological achievements and service systems tailored for data centre scenarios at Booth 3-G5. The company will share its accumulated technical insights in thermal management with the Asia-Pacific market, and explore the high-quality development path for intelligent computing infrastructure alongside global industry partners.

As a highly influential industry event in the Asia-Pacific data centre landscape, this year's Asia Data Centre Expo takes "Shaping the Future of Data Centres" as its core theme. It focuses on the innovation and resilience of the cornerstone of the digital economy, covering key topics including infrastructure modernization, AI-ready environment construction, and digital operation upgrading. It serves as a core exchange platform for the industry to connect with cutting-edge technologies and implement cooperative projects.

Against the backdrop of the rapid large-scale deployment of large AI models and high-density intelligent computing clusters, the heat dissipation efficiency, operational stability and full-lifecycle energy efficiency performance of data centres have become core factors affecting the high-quality development of computing power infrastructure. Traditional thermal management solutions can no longer meet the stringent requirements of high-density computing scenarios, driving a continuously rising industry demand for customized thermal management solutions that combine high heat transfer efficiency and exceptional operational reliability.

Leveraging its years of technical accumulation in the industrial heat exchanger field, as well as extensive hands-on experience in delivering projects under demanding working conditions across multiple sectors including global industrial OEMs, energy and chemical, power electronics and more, API Heat Transfer has completed targeted technical optimizations for high-density computing scenarios in data centres. At this exhibition, the company will highlight its product matrix of plate heat exchangers, shell-and-tube heat exchangers, and plate-fin heat exchangers that adapt to scenario-specific requirements, alongside customized thermal management solutions for liquid-cooled data centres and indirect evaporative cooling systems. These solutions effectively help data centre operators reduce PUE, enhance the operational stability of core computing power equipment, and achieve dual optimization of energy consumption and operation & maintenance costs while meeting the demand for large-scale computing power deployment.

For the fast-growing data centre market in the Asia-Pacific region, API Heat Transfer will take this exhibition as an opportunity to further clearly communicate its technical and service capabilities to industry clients. It will deliver full technical support covering solution design, product delivery and full-lifecycle operation and maintenance for data centre projects of different scales and computing densities, providing reliable heat transfer support for the construction of green computing power infrastructure.

During the exhibition, API Heat Transfer's professional team will be present at the site throughout the event, providing one-on-one requirement matching services for visiting attendees at Booth 3-G5. The team will conduct in-depth exchanges with industry peers from around the world on core industry topics including data centre thermal dissipation system upgrading, green computing power construction, and the implementation of customized heat transfer solutions.